FREUDENSTADT, GERMANY – Schmid Group N.V. has completed a $30 million financing round following the closing of the second $15 million tranche of convertible notes issued to an institutional investor.

BOSTON, MA – Worldwide smartphone shipments are expected to fall 12.9% in 2026 to about 1.1 billion units, marking the largest annual decline on record as a global memory shortage disrupts the ...

His keynote, “No Business Doing This: How a Wild Idea Became a Mission-Critical System Through Relentless Iteration and a Loyal Manufacturing Partner,” takes place April 29 from 11 a.m. to 12 p.m. at ...

“Our goal is to remove friction from the design process by making CAD models easy to find and easy to use,” said Natasha Baker, CEO at SnapMagic. “Partnering with Future Electronics allows SnapMagic ...

SAN JOSE – Cadence Design Systems has acquired EMA Design Automation, its key distributor in the printed circuit board software design space, according to an announcement the ECAD software giant sent ...

ECIA’s Industry Pulse: Electronic Component Trends and Sentiment provides highly valuable and detailed visibility on industry expectations in the near-term through the monthly and quarterly surveys.

CI-ONE integrates a Ka-band power amplifier and single-pole double-throw (SPDT) RF switch into a compact surface-mount module designed for satellite communication, aerospace, radar and emerging 5G/6G ...

Panasonic Industry Co., Ltd. will invest approximately 7.5 billion yen into Panasonic Industrial Devices Materials (Guangzhou) Co., Ltd. (Guangzhou Factory), to add an additional production line ...

Freudenstadt, Germany, March 04, 2026 – SCHMID Group (NASDAQ: SHMD) has successfully delivered the first specialized InfinityLine H+ system designed for Panel-Level Packaging (PLP) applications with ...

Siemens today announced Inventec Corporation, a global leader in high-tech electronics and server manufacturing, has adopted Siemens’ Valor NPI software and Process Preparation X solutions from the ...

TNC Series NTC thermistors expand Stackpole’s passive component portfolio into temperature sensing applications using thick-film construction for improved mechanical robustness compared with ...

A study shows how high-thermal dielectrics outperform FR-4 for bulk heat spreading, with surface-mount thermal bridges ...